Ring removal stage require the dicing tape cut according to specification: On single wafers Silicon wafers: - 100mm diameter, 525um reduced to 100um - 150mm diameter, 625um reduced to 200um
GaN 2" wafer (mounted on frame), 320um reduced to 100um Fused silica wafer, 525um reduced to 200um Pyrex wafer (borosilicate), 525um reduced to 200um Glass wafer (sodalime), 525um reduced to 200um On stacked wafers Pyrex/Si anodic bonding, Si thinning down to 30um Si/Si wafers mounted with quickstick 135, Si thinning down to 50um Si/glass wafers bonded with parylene, Si thinning down to 50um Si/Si wafers mounted with spined glue, Si thinning down to 50um Chips on UV-tape GaN 2cmX2cm, 320um reduced to 100um Silicon 1cmx1cm, 380um thinning down to 50um Smaller Si chips (few mm), 380um thinning down to 50um Fused silica 1cmx1cm, 380um thinning down to 50um Pyrex 1cmx1cm, 380um thinning down to 50um
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